Multilayer Printed Circuit Boards

E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
Silver Finishing
No Silkscreen and no Solder
VAI

E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
Silver Finishing
Silkscreen on one side and Solder on both
VAI

E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
Silver Finishing
No Silkscreen and no Solder
VAI

E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
Silver Finishing
Silkscreen on one side and Solder on both
VAI
Products







Shopping Cart
My Account



Quality PCB - Fast service in 24 hours
mdsrl.it - Millennium Dataware Srl - VAT ID IT01763840061

Sensitive data sent through SSL protocol
