Multilayer Printed Circuit Boards
48 hours to 11 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
No Silkscreen and no Solder
VAI 3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI 48 hours to 11 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
No Silkscreen and no Solder
VAI 3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
No Silkscreen and no Solder
VAI 3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI 48 hours to 11 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
No Silkscreen and no Solder
VAI 3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI
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