RF Printed Circuit Boards

24 hours to 10 working days delivery (your choose)
E-TEST Included
Single Side
Different Copper and support thickness
Immersion Silver Finish
No Silkscreen no Solder
VAI

48 hours to 11 working days delivery (your choose)
E-TEST Included
Single Side
Immersion Silver Finish
Different Copper and support thickness
Silkscreen on one side and Solder on one side (even the same side)
VAI

24 hours to 10 working days delivery (your choose)
E-TEST Included
Plated Through Hole
Different Copper and support thickness
Immersion Silver Finish
No Silkscreen no Solder
VAI

48 hours to 11 working days delivery (your choose)
E-TEST Included
Plated Through Hole
Immersion Silver Finish
Different Copper and support thickness
Silkscreen on one side and Solder on both
VAI

48 hours to 11 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
Silver Finishing
No Silkscreen and no Solder
VAI

3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
Silver Finishing
Silkscreen on one side and Solder on both
VAI

48 hours to 11 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
Silver Finishing
No Silkscreen and no Solder
VAI

3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
Silver Finishing
Silkscreen on one side and Solder on both
VAI
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