RF Printed Circuit Boards

24 hours to 10 working days delivery (your choose)
E-TEST Included
Single Side
Different Copper and support thickness
HASL lead-free Finish
No Silkscreen no Solder
VAI

48 hours to 11 working days delivery (your choose)
E-TEST Included
Single Side
HASL lead-free Finish
Different Copper and support thickness
Silkscreen on one side and Solder on one side (even the same side)
VAI

24 hours to 10 working days delivery (your choose)
E-TEST Included
Plated Through Hole
Different Copper and support thickness
HASL lead-free Finish
No Silkscreen no Solder
VAI

48 hours to 11 working days delivery (your choose)
E-TEST Included
Plated Through Hole
HASL lead-free Finish
Different Copper and support thickness
Silkscreen on one side and Solder on both
VAI

3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI

3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI
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