RF Printed Circuit Boards
Made on Roger 4350B for RF applications up to 24 GHz
24 hours to 10 working days delivery (your choose)
E-TEST Included
Single Side
Different Copper and support thickness
HASL lead-free Finish
No Silkscreen no Solder
VAI Made on Roger 4350B for RF applications up to 24 GHz
48 hours to 11 working days delivery (your choose)
E-TEST Included
Single Side
HASL lead-free Finish
Different Copper and support thickness
Silkscreen on one side and Solder on one side (even the same side)
VAI Made on Roger 4350B for RF applications up to 24 GHz
24 hours to 10 working days delivery (your choose)
E-TEST Included
Plated Through Hole
Different Copper and support thickness
HASL lead-free Finish
No Silkscreen no Solder
VAI Made on Roger 4350B for RF applications up to 24 GHz
48 hours to 11 working days delivery (your choose)
E-TEST Included
Plated Through Hole
HASL lead-free Finish
Different Copper and support thickness
Silkscreen on one side and Solder on both
VAI Made on Roger 4350B for RF applications up to 24 GHz
48 hours to 11 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
No Silkscreen and no Solder
VAI Made on Roger 4350B for RF applications up to 24 GHz
3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI Made on Roger 4350B for RF applications up to 24 GHz
48 hours to 11 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
No Silkscreen and no Solder
VAI Made on Roger 4350B for RF applications up to 24 GHz
3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI
24 hours to 10 working days delivery (your choose)
E-TEST Included
Single Side
Different Copper and support thickness
HASL lead-free Finish
No Silkscreen no Solder
VAI Made on Roger 4350B for RF applications up to 24 GHz
48 hours to 11 working days delivery (your choose)
E-TEST Included
Single Side
HASL lead-free Finish
Different Copper and support thickness
Silkscreen on one side and Solder on one side (even the same side)
VAI Made on Roger 4350B for RF applications up to 24 GHz
24 hours to 10 working days delivery (your choose)
E-TEST Included
Plated Through Hole
Different Copper and support thickness
HASL lead-free Finish
No Silkscreen no Solder
VAI Made on Roger 4350B for RF applications up to 24 GHz
48 hours to 11 working days delivery (your choose)
E-TEST Included
Plated Through Hole
HASL lead-free Finish
Different Copper and support thickness
Silkscreen on one side and Solder on both
VAI Made on Roger 4350B for RF applications up to 24 GHz
48 hours to 11 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
No Silkscreen and no Solder
VAI Made on Roger 4350B for RF applications up to 24 GHz
3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI Made on Roger 4350B for RF applications up to 24 GHz
48 hours to 11 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
No Silkscreen and no Solder
VAI Made on Roger 4350B for RF applications up to 24 GHz
3 to 12 working days delivery (your choice)
E-TEST Included
Minimum hole diameter 0,20 mm
PIN Lamination
OIR: CCD Optical Inner Layer Registration
35 µm copper on all layers, standard stack-up
HASL lead-free Finish
Silkscreen on one side and Solder on both
VAI
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